Journal of Testing and Evaluation

About this journal

This journal is published in six issues per year. Some issues, in whole or in part, may be Special Issues focused on a topic of interest to our readers.

This flagship ASTM journal is a multi-disciplinary forum for the applied sciences and engineering. Published bimonthly, online only, the Journal of Testing and Evaluation presents new technical information, derived from field and laboratory testing, on the performance, quantitative characterization, and evaluation of materials. Papers present new methods and data along with critical evaluations; report users' experience with test methods and results of interlaboratory testing and analysis; and stimulate new ideas in the fields of testing and evaluation.

Major topic areas are fatigue, fracture, and creep, high/low temperature mechanical testing, fire testing, polymers, elastomers, wood, soils, metallics, additive manufacturing, pavement and construction materials, and statistics. Paper types include technical manuscripts, review articles, technical notes, discussions, closures, editorials, and book reviews. All papers are peer reviewed.

First Look Papers

Note to users: The section First Look Papers contains peer reviewed and accepted articles to be published in this journal. When the final article is assigned to an issue of the journal, the First Look Papers version will be removed from this section and will appear in the associated journal issue.

Issues

2023

Volume 51 Issue 1 Special Issue on the Future of Cognitive Computing in Healthcare

2022

2021

2020

2019

2018

2017

2016

2015

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2009

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1973

Editorial Board

Editor-in-Chief

Dr. M. R. Mitchell, Mechanics & Materials, LLC, Flagstaff, AZ, USA

Editorial Board Members

Dr. Ali Abolmaali, Wayne State University, Detroit, MI, USA
Dr. Aziz Amoozegar, North Carolina State University, Raleigh, NC, USA
Dr. Farhad Aslani, University of Western Australia, Crawley, WA, Australia
Dr. Nemkumar Banthia, University of British Columbia, Vancouver, BC, Canada
Dr. Filippo Berto, University of Padua, Italy, and Norwegian University of Science and Technology, Trondheim, Norway
Dr. Krishna Prapoorna Biligiri, Indian Institute of Technology, Tirupati, Andhra Pradesh, India
Dr. Laura Bix, Michigan State University, East Lansing, MI, USA
Dr. Andrew F. Braham, University of Arkansas, Fayetteville, AR, USA
Dr. Andreas J. Brunner, Zürich, Switzerland
Professor Andrea Carpinteri, University of Parma, Parma, ITALY
Dr. Wen-Ruey Chang, Liberty Mutual Research Institute for Safety, Hopkinton, MA, USA
Dr. Dar Hao Chen, Texas A&M University, College Station, TX, USA
Dr. Tong Cui, Qualcomm Packaging, San Diego, CA, USA
Mr. John S. Dick, Alpha Technologies, Akron, OH, USA
Prof. Ying Fang, Xiamen University, Xiamen, China
Dr. Tâmara França, Mississippi State University, Starkville, MS, USA
Dr. Alessandro Gardi, RMIT University, Bundoora, VIC, Australia
Dr. Piotr Gas, AGH University of Science and Technology, Krakow, Poland
Dr. Yu-Ning Louis Ge, National Taiwan University, Taipei, Taiwan
Dr. Meng Guo, Beijing University of Technology, Beijing, China
Dr. Rajeev Kumar Gupta, University of Akron, Akron, OH, USA
Prof. Jim Hartman, AZGaitero Engineering, Tempe, AZ, USA
Dr. Leila Hashemian, University of Alberta, Edmonton, Alberta, Canada
Mr. Hui-Min (Hui) Huang, National Institute for Standards and Technology (NIST), Gaithersburg, MD, USA
Dr. Xiaoming Huang, Southeast University, Nanjing, China
Mr. Thomas S. Jones, Howmet Research Corp., Whitehall, MI, USA
Dr. Sreeramesh Kalluri, Ohio Aerospace Institute, Brook Park, OH, USA
Dr. Sivakumar Kandasami, Larsen & Toubro Construction, Chennai, India
Dr. Xin Kang, Hunan University, Hunan, Changsha, China
Dr. Vistasp Karbhari, University of Texas at Arlington, Arlington, TX, USA
Dr. Behnoud Kermani, The Transtec Group, Inc., Enola, PA, USA
Dr. Yong-Rak Kim, University of Nebraska-Lincoln, Lincoln, NE, USA
Dr. Young Hoon Kim, University of Louisville, Louisville, KY, USA
Dr. Govindaraju Kondaswamy, Massey University, Palmerston, North New Zealand
Dr. Eva Lantsoght, Delft University of Technology, Delft, Netherlands, and Universidad San Francisco de Quito, Quito, Ecuador
Dr. Mohammad J. Mahtabi, University of Tennessee at Chattanooga, Chattanooga, TN, USA
Dr. Susan M. Marvin, Federal Bureau of Investigation Laboratory, Quantico, VA, USA
Douglas C. Meier, National Institute of Standards and Technology, Gaithersburg, MD, USA
Dr.-Ing. Miomir Miljković, University of Niš, Niš, Serbia
Mr. Thomas F. O’Connor, Milan, MI, USA
Dr. Božidar V. Popović, University of Montenegro, Podgorica, Montenegro
Dr. Elena Romeo, University of Parma, Parma, Italy
Dr. Gourab Saha, National Institute of Technology Rourkela, Sundargarh, India
Dr. Rajarshi Saha, Bridgelux, Inc., Livermore, CA, USA
Dr. Scott A. Schroeder, Exponent, Los Angeles, CA, USA
Dr. Steven J. Shaffer, Shaffer Tribology Consulting, Campbell, CA, USA
Dr. Suraj Sharma, University of Georgia, Athens, GA, USA
Dr. Ranganath K. Shastri, Plastics Solutions, Midland, MI, USA
Dr. Punith V. Shivaprasad, Clemson University, Clemson, SC, USA
Dr. Mark Sidebottom, Miami University, Oxford, OH, USA
Dr. Cy (Chor-yiu) Sin, National Tsing Hua University, Hsinchu, Taiwan, R.O.C
Dr. C. Elizabeth Stokes, Mississippi State University, Starkville, MS, USA
Dr. Stein Sture, University of Colorado at Boulder, Boulder, CO, USA
Dr. Julian Tao, University of Akron, Akron, OH, USA
Dr. Ingrid Tomac, University of California, San Diego, San Diego, CA, USA
Dr. Blanka Tomkova, Technical University of Liberec, Liberec, Czech Republic
Dr. Sabrina Vantadori, University of Parma, Parma, Italy
Dr. Sandra Varnaitė-Žuravliova, Center for Physical Sciences and Technology, Kaunas, Lithuania
Dr. Matthieu Vignes, Massey University Manawatu, Palmerston North, New Zealand
Dr. Hao Wang, Rutgers, The State University of New Jersey, Piscataway, NJ, USA
Dr. Jinfeng Wang, Zhejiang University, Hangzhou, China
Dr. Shuying Wang, Central South University, Hunan, China
Dr. Shaopeng Wu, Wuhan University of Technology, Wuhan, China
Dr. Shenghua Wu, University of South Alabama, Mobile AL, USA
Professor Feipeng Xiao, Clemson University, Clemson, SC, USA
Dr. Yang Xiao, Chongqing University, Chongqing, China
Dr. Fangwei Yu, Chinese Academy of Sciences, Chengdu, China
Dr. Xiong Yu, Case Western Reserve University, Cleveland, OH, USA
Professor Menglan Zeng, Hunan University, Changsha, P.R. China
Dr. Henglong Zhang, Hunan University, Changsha, China

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Details

ISSN: 0090-3973

E-ISSN: 1945-7553

Coden: JTEVAB